上海SMT贴片加工厂
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伟利仕(上海)电子有限公司

伟利仕(上海)电子有限公司

公司地址:上海市闵行区闵北路288号

总      机:021-64064840 

业务电话:18201866769

                13818505445

传  真:021-64065245

网       址:   www.wellex.com.cn

业务邮箱:sales@wellex.com.cn


 BGA设备&能力  BGA Equipment & Capability 


1、BGA工艺制程控制: BGA烘烤、锡膏回温、网板印刷、炉温

Process control of BGA assembly: Bulk BGA baking, warming-up solder paste, stencil printing, oven temperature.


2、BGA 最小间距:0.3MM

Minimum space between components:0.3MM



SMT 设备能力  SMT Capability


1、生产线贴装产能:9500万点/月

SMT line productivity: 95 million points per month


2、大PCB板尺寸:L = 510MM, W = 460MM

Maximum size of PCB: L = 510MM, W = 460MM


3、最小PCB板尺寸:L = 50MM, W = 30MM

Minimum size of PCB: L = 50MM, W = 30MM


4、贴片PCB板厚度:0.4MM - 4MM (1-12层)

Thickness of PCB: 0.4MM - 4MM (1-12 layers)


5、贴片最小尺寸:0201 (0.6*0.3MM)

Minimum component size for SMT: 0201 (0.6*0.3MM)


6、贴片大异型:33.5*33.5MM

Maximum component size for SMT: 33.5*33.5MM


7、芯片最小间距:0.2MM

Minimum space between components:0.2MM