BGA设备&能力 BGA Equipment & Capability
1、BGA工艺制程控制: BGA烘烤、锡膏回温、网板印刷、炉温
Process control of BGA assembly: Bulk BGA baking, warming-up solder paste, stencil printing, oven temperature.
2、BGA 最小间距:0.3MM
Minimum space between components:0.3MM
SMT 设备能力 SMT Capability
1、生产线贴装产能:9500万点/月
SMT line productivity: 95 million points per month
2、大PCB板尺寸:L = 510MM, W = 460MM
Maximum size of PCB: L = 510MM, W = 460MM
3、最小PCB板尺寸:L = 50MM, W = 30MM
Minimum size of PCB: L = 50MM, W = 30MM
4、贴片PCB板厚度:0.4MM - 4MM (1-12层)
Thickness of PCB: 0.4MM - 4MM (1-12 layers)
5、贴片最小尺寸:0201 (0.6*0.3MM)
Minimum component size for SMT: 0201 (0.6*0.3MM)
6、贴片大异型:33.5*33.5MM
Maximum component size for SMT: 33.5*33.5MM
7、芯片最小间距:0.2MM
Minimum space between components:0.2MM